ASML announced that the Dutch government has revoked the export license of two of its lithography systems and can no longer ship these tools to Chinese customers. The impact on ASML will not be significant, as these machines are designed for advanced process technologies, while the vast majority of ASML’s customers in China are focused on mature production nodes. However, it further restricts China’s access to the latest chip manufacturing technologies.
The tools in question are ASML’s Twinscan NXT: 2050i and NXT: 2100i lithography systems, the company’s most advanced deep ultraviolet (DUV) machines. Both machines are capable of ≤38 nm resolution and can be used to manufacture logic chips in 7 nm and even 5 nm process technologies, although with multiple patterning. Both machines can process up to 295 wafers per hour and can be used for both logic and memory production.
The NXT: 2100i also features new hardware and software innovations that enable improved single machine overlay by up to 10% (0.9 nm) and combined machine overlay by 13% (1.3 nm) compared to the NXT: 2050i.
Currently, the only Chinese chip manufacturer with a 7nm process technology is SMIC. It uses previously imported DUV machines with multiple patterning. As a result of these new restrictions, it will not be able to obtain additional tools to increase its 7nm production. This could impact Huawei, one of the few Chinese chip designers using SMIC’s 7nm production node.
Since both machines utilize technologies designed in the US, they are subject to export rules from both the US and the Netherlands. The US does not allow shipments of wafer manufacturing equipment that can be used to produce logic chips at 14nm/16nm and more advanced manufacturing nodes, so ASML cannot actually ship these tools to Chinese customers.
“In recent discussions with the US government, ASML has gained further clarity on the scope and impact of US export control regulations,” says a statement from ASML. “The latest US export regulations (published on October 17, 2023) impose restrictions on certain critical mid-level DUV immersion lithography systems for a limited number of advanced production facilities.”